11T642V - Walter ZIP ONE 4.5 Inch Type 27 Ultra-Thin Cutting Wheel 5-Pack

Precision Engineering for Thin Gauge Metals

The Walter ZIP ONE 11T642V represents a significant leap in abrasive technology, specifically engineered for the unique challenges of cutting thin gauge metals. At an ultra-thin thickness of just 1/32 inch, this wheel is designed to minimize the removal of material, which directly translates to lower energy consumption and reduced friction during the cut. The Type 27 depressed center configuration provides the structural rigidity necessary for such a thin profile while allowing the locking nut to be recessed, enabling flush cutting applications that flat wheels cannot achieve.

Constructed with Walter's proprietary reinforcement technology, the ZIP ONE maintains high safety standards despite its slender profile. It is formulated to cut cool, preventing the heat buildup that typically causes bluing or discoloration on stainless steel and warping on thin sheet metal. This makes it an essential consumable for industries where finish quality and dimensional tolerance are critical, such as pharmaceutical equipment manufacturing and architectural metalwork.

The 11T642V is optimized for use on 4-1/2 inch angle grinders with a standard 7/8 inch arbor. Its composition is free from iron, sulfur, and chlorine, ensuring it will not contaminate stainless steel surfaces. This pack of 5 wheels ensures that professionals have the premium consumables needed for intricate tasks requiring steady hands and reliable performance.

Technical Specifications and Performance

The ZIP ONE's performance metrics are defined by its speed and cut quality. By removing less material, the wheel moves through the workpiece faster than standard 1/16 inch or .045 inch wheels. This speed reduces the dwell time of the abrasive on the metal, which is the primary factor in heat generation. The result is a cut that is virtually burr-free, eliminating the secondary step of deburring and grinding, thereby streamlining production workflows in high-volume environments.