K4586-045 - Lincoln HyperFill .045 Installation Kit for Power Feed 84

Maximize Deposition with Precision Engineering

The Lincoln Electric K4586-045 HyperFill Semi-automatic .045 One-Pak is a specialized installation kit designed to bridge the gap between standard single-wire MIG welding and complex tandem-wire systems. This kit is the hardware key to unlocking the patented HyperFill™ technology on compatible Lincoln Electric Power Wave® systems and Power Feed® 84 wire feeders. By utilizing two smaller .045-inch (1.2 mm) wires to produce a larger, more stable arc, HyperFill allows for significantly increased deposition rates—often exceeding 20 lbs/hr (9 kg/hr)—while maintaining the ease of use associated with a single-wire process.

Technically, this kit addresses the critical mechanical requirements of feeding two wires simultaneously through a single torch cable. It includes precision-machined drive rolls designed to grip two wires without deformation, ensuring consistent feeding speeds which are crucial for arc stability. The kit also supplies the specialized front-end consumables for the Magnum® PRO gun series, including the proprietary HyperFill contact tip. This tip is engineered to electrically energize both wires at the exact same potential, creating a single, unified arc plasma. This results in a wide, smooth arc cone that improves wetting and penetration profiles, reducing the risk of lack of fusion often seen in high-speed welding.

For industrial MRO and heavy fabrication environments, the K4586-045 represents a strategic upgrade. It allows existing capital equipment (Power Wave power sources) to perform at levels typically reserved for automated or tandem systems. The reduction in spatter and the improved bead profile also translate to reduced post-weld cleaning and grinding, further optimizing the total production cycle time. This One-Pak consolidates all necessary conversion parts—liner, diffuser, nozzle, tips, and guides—into a single SKU, simplifying inventory management and ensuring component compatibility.