SCPF-1 - Harris Stay-Clean Paste Flux 1 lb Jar

Technical Overview of Harris Stay-Clean® Paste Soldering Flux

The Harris Stay-Clean® Paste Soldering Flux (SKU: SCPF-1) is a general-purpose, active chloride-based flux designed for industrial and commercial soldering applications. Engineered to meet rigorous industry standards, including Federal Specification O-F-506 C Type 1 Form A and Commercial Specification A-51145 D Type 1 Form A, this flux ensures reliable oxide removal and wetting on a variety of base metals. It is particularly effective on copper, brass, bronze, steel, galvanized steel, and Monel®, making it a versatile consumable for mixed-metal fabrication and repair.

The flux operates within an active temperature range of 350°F to 600°F (177°C to 316°C), accommodating a broad spectrum of soft solder alloys, including tin-lead, tin-antimony, and modern lead-free compositions. Its paste formulation provides excellent adherence to workpieces, preventing runoff during heating cycles and ensuring consistent coverage even on vertical or overhead joints. While highly effective for structural soldering, the residue is corrosive and must be removed post-operation to prevent long-term oxidation or pitting of the base metal. Consequently, this product is strictly prohibited for use in electrical or electronic assemblies where residue entrapment could lead to component failure.

Compliance is a key feature of the Stay-Clean® line. This product adheres to EU REACH and RoHS directives, ensuring it meets modern environmental and safety standards for hazardous substances. It is packaged in a durable 1 lb jar, suitable for high-volume workshop environments. Please note that this flux is not suitable for aluminum, magnesium, or titanium applications, for which specialized fluxes are required.